pk386 (v1.1) march 11, 2011 100% material declaration data sheet CSG324 average weight: 0.524 g component substance description cas# or description % of component use in product component weight/ substance weight (in grams) component % of total silicon die 0.022310 4.258 silicon 7440-21-3 100.00 basis 0.022310 die attach material 0.007051 1.346 silver 7440-22-4 77.50 basis 0.005465 bismaleimide monomer trade secret 15.00 basis 0.001058 acrylate monomer trade secret 7.50 basis 0.000529 mold compound 0.216190 41.258 solid epoxy resin trade secret 5.00 basis 0.010810 phenol resin trade secret 5.00 basis 0.010810 fused silica 60676-86-0 87.45 basis 0.189058 metal hydroxide trade secret 2.00 basis 0.004324 carbon black 1333-86-4 0.55 basis 0.001189 gold wire 0.007801 1.489 gold 7440-57-5 99.05 basis 0.007727 palladium 7440-05-3 0.95 basis 0.000074 solder balls 0.114184 21.791 tin 7440-31-5 96.50 basis 0.110188 silver 7440-22-4 3.00 basis 0.003426 copper 7440-50-8 0.50 basis 0.000571 substrate 0.156464 29.860 copper 7440-50-8 48.13 basis 0.075300 nickel 7440-02-0 2.94 basis 0.004598 gold 7440-57-5 0.35 basis 0.000550 bt (core) 21645-51-2/ 7440-50-8/ epoxy resin 44.31 basis 0.069324 solder mask 14807-96-6/ 7727-43-7/ 7631- 86-9/ 34590-94-8/ 85954-11-6 4.28 basis 0.006692 ? copyright 2011 xilinx, inc. xilinx, the xilinx logo, virtex, spartan, ise, and other designa ted brands included h0.erein are trademarks of xilinx in the united states and other countries. all other trademarks are the property of their respective owners pk386 (v1.1) march 11, 2011 www.xilinx.com 1
100% material declaration data sheet ? CSG324 revision history the following table shows the revision history for this document. pk386 (v1.1) march 11, 2011 www.xilinx.com 2 date version description of revisions 12/3/10 1.0 initial xilinx release. 03/11/11 1.1 revised component weights based on latest data notice of disclaimer xilinx regards this materials data to be correct but makes no guarantee as to its accuracy or completeness, including, but not limited to, with respect to its compliance with applicable environmental laws and regulations. xilinx subcontracts the production, test an d assembly of hardware devices to independent third-party vendors and material s suppliers (?contra ctors?). all data provided hereunder is based on inform ation received from contractors. xilinx has not independently verified the accuracy or completeness of this information which is provided solely for your reference in connection with the use of xilinx products .
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